Published by Eric Bogatin on 18 Jun 2008
I got a note from John Stolp of Rogers Corp about a new material system Rogers Corp is coming out with called Heatwave. This is an aluminum base material with small silicon carbide (SiC) particles dispersed. The key feature of this new material is that its TCE can be varied from about 5 to 16 ppm/degC, while achiving a thermal conductivity about 1/3 to 1/2 that of copper and being considerably lighter than CuW. This could be used as a lid material for flip chip die, or a substrate base material for sequential build up in GaSa or InP circuits. Its light weight is particulary attractive for aerospace and satellite applications.